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Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films

Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films

Tung-Han Chuang, Po-Ching Wu, Yu-Chang Lai, Pei-Ing Lee
Copyright: © 2022 |Volume: 12 |Issue: 1 |Pages: 16
ISSN: 2156-1680|EISSN: 2156-1672|EISBN13: 9781683182283|DOI: 10.4018/IJMMME.313037
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MLA

Chuang, Tung-Han, et al. "Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films." IJMMME vol.12, no.1 2022: pp.1-16. http://doi.org/10.4018/IJMMME.313037

APA

Chuang, T., Wu, P., Lai, Y., & Lee, P. (2022). Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films. International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME), 12(1), 1-16. http://doi.org/10.4018/IJMMME.313037

Chicago

Chuang, Tung-Han, et al. "Low-Temperature Direct Bonding of 3D-IC Packages and Power IC Modules Using Ag Nanotwinned Thin Films," International Journal of Manufacturing, Materials, and Mechanical Engineering (IJMMME) 12, no.1: 1-16. http://doi.org/10.4018/IJMMME.313037

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Abstract

Ag has the lowest stacking fault energy of all metals, which allows twin formation to occur more easily. The (111)-preferred orientation Ag nanotwinned films is fabricated by either sputtering or evaporation method exhibit columnar Ag grains grown vertically on Si substrates. Ag nanotwinned films have a (111)-preferred orientation with a density about 98% and diffusivity that is 2 to 5 orders of magnitude higher than those of (100) and (110) surfaces. Low temperature direct bonding with (111)-oriented Ag nanotwins films is proposed to fulfil the requirements for wafer-on-wafer (WoW), chip-on-wafer (CoW), and chip-on-wafer-on-substrate (CoWoS) advanced 3D-IC packaging, with the process temperature drastically reduced to 100°C. Such an innovative bonding method also provides a promising solution for die attachment of Si chips with DBC-ceramic substrates for power module packaging.